Advanced MEMS packaging - download pdf or read online

By John H. Lau ... [et al.]

ISBN-10: 0071626239

ISBN-13: 9780071626231

ISBN-10: 0071627928

ISBN-13: 9780071627924

ISBN-10: 0071741836

ISBN-13: 9780071741835

ISBN-10: 1615831592

ISBN-13: 9781615831593

Advent to MEMS --
Advanced MEMS packaging --
Enabling applied sciences for complicated MEMS packaging --
Advanced MEMS wafer-level packaging --
Optical MEMS packaging : communications --
Optical MEMS packaging : bubble swap --
Optical MEMS : microbolometer packaging --
Bio-MEMS packaging --
Biosensor packaging --
Accelerometer packaging --
Radiofrequency MEMS switches --
RF MEMS tunable capacitors and tubable band-pass filters --
Advanced packaging of RF MEMS units

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Extra info for Advanced MEMS packaging

Example text

146. , Sampsell, Jeffrey (US), CN1755473 (A)—2006-04-05. 147. “Apparatus and method for wafer level packaging,” Chen, Jen-Yi (TW), Chiou, Jing-Hung (TW) (+1), TW236111 (B)— 2005-07-11. 148. “Silicon packaging for opto-electronic modules,” Epitaux, Marc (US), WO2006074048 (A2)—2006-07-13. 149. “Integrated MEMS packaging,” Hartzell, John W. (US), Walton, Harry G. (GB) (+1), US2006148137 (A1)—2006-07-06. 150. “System and method for display device with activated desiccant,” Cummings, William J. (US), MXPA05009407 (A)—200603-29.

58. “Multiple internal seal ring micro-electro-mechanical system vacuum packaging method,” Hayworth, Ken J. (US), Yee, Karl Y. (US) (+5), US2007298542 (A1)—2007-12-27. 59. “Method for forming a hermetically sealed cavity,” Witvrouw, Ann (BE), Rico, Raquel H. (ES) (+1), US2007298238 (A1)—200712-27. Introduction to MEMS 60. “Stacked die package for MEMS resonator system,” Gupta, Pavan (US), Razda, Eric (US), US2007290364 (A1)—2007-12-20. 61. “Hermetically sealed wafer level packaging for optical MEMS devices,” Yang, Xiao (US), GB2439403 (A)—2007-12-27.

Felton, Lawrence E. (Hopkinton, MA), Harncy, Kieran P. (Andover, MA), Roberts, Carl M. (Topsfield, MA), “Wafer level capped sensor,” October 2, 2007. Zhao, Yang (Andover, MA), “Wafer-level package for integrated circuits,” August 28, 2007. Floyd, Philip D. (Redwood City, CA), “Method and system for sealing a substrate,” August 21, 2007. Mancosu, Federico (Milan, IT), Romeo, Fabio (Monza, IT), Brusarosco, Massimo (Cesano Boscone, IT), Fioravanti, Anna Paolo (Monza, IT), “Movable unit and system for sensing at least one characteristic parameter of a tyre,” July 17, 2007.

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Advanced MEMS packaging by John H. Lau ... [et al.]

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